South Korea-based DeepX tapes out DX-M2, an edge AI chip to run inference of 100B-parameter LLMs on robots and drones, targeting fall 2027 for mass production (Sally Ward-Foxton/EE Times)
Semiconductor developer DeepX has achieved tape-out for its specialized DX-M2 processor. The hardware is specifically tailored to run inference tasks for massive large language models reaching up to 100 billion parameters. Built directly for deployment on robotic platforms and drones, the device enables high-tier machine intelligence at the edge. The company currently projects reaching commercial mass production for the component in the fall of 2027.
Key points
Physical tape-out marks a critical technical development step toward achieving edge-based…: Physical tape-out marks a critical technical development step toward achieving edge-based generative machine learning workloads.
Moving 100-billion-parameter model inference directly onto drones eliminates the operatio…: Moving 100-billion-parameter model inference directly onto drones eliminates the operational necessity for constant off-board server communication.
Commercial implementation remains a long-term roadmap goal with volume manufacturing slat…: Commercial implementation remains a long-term roadmap goal with volume manufacturing slated to begin in autumn 2027.
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