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Applied Materials to raise BESI stake to about 20%

By · Published by Everything Blog

In short

Applied Materials is expanding its stake in BESI to 20%, from 9%, as part of a partnership focused on advanced chip-packaging technologies vital for AI applications. The companies have collaborated since 2020 on hybrid bonding technology, a key technique for connecting chips in high-performance applications.

Key points

  • Applied Materials is expanding its stake in BESI.: Applied Materials is expanding its stake in BESI.
  • The partnership focuses on advanced chip-packaging technologies vital for AI applications.: The partnership focuses on advanced chip-packaging technologies vital for AI applications.
  • The companies have collaborated since 2020 on hybrid bonding technology.: The companies have collaborated since 2020 on hybrid bonding technology.

Sources checked by our analysis pipeline: 1

Oct 26 : Applied Materials said on Monday it plans to raise its stake in Dutch company BE Semiconductor Industries (BESI) to about 20 per cent from 9 per cent, deepening a partnership focused on advanced chip-packaging technologies used in AI applications.

Here are more details:

• Applied Materials, BESI's largest shareholder since buying a 9 per cent stake in April 2025, said it entered into an accelerated share purchase agreement for the semiconductor equipment maker's additional shares, subject to US antitrust review

• The expanded partnership will focus on new chip-connection and packaging technologies aimed at supporting next-generation AI semiconductors

• Applied Materials said it does not plan to raise its stake beyond about 20 per cent or seek board representation at BESI

• The companies have collaborated since 2020 on hybrid bonding technology, a key advanced packaging technique used in high-performance chips

Original source: www.channelnewsasia.com

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